Boron Nitride Based Solids
Description
Hot-pressed boron nitride (BN) solids are easily machinable materials formed by sintering at high pressures and temperatures. BN solids deliver excellent electrical insulation (except for BN-TiB2 composites), and excellent resistance to molten metals, molten salts and many plasma environments.
Our BN solids portfolio includes grades with and without binders, as well as composites to meet a wide array of specifications. Complementary ceramic additives can also be incorporated to optimize machinability, corrosion resistance and abrasion resistance. With comprehensive machining capabilities, our BN solids portfolio is available in everything from common stock shapes and sizes to bespoke items.
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High Temperature Capability |
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Moisture Resistance |
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Thermal Shock Resistance |
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Thermal Conductivity |
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Electrical Resistance |
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Machinability |
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High Purity |
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Mechanical Properties |
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Thermal Management of Electronic Devices
High Temperature Applications
Temperature stability and excellent resistance to thermal shock make BN an excellent candidate to consider for the toughest high temperature applications such as plasma arc welding and semiconductor processing.
Molten Metal Handling
BN is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents. These characteristics, combined with low thermal expansion, may make it an excellent candidate to consider for use in interface materials used in various molten metal processes.
Applications
- Insulators for electrical equipment, high temperature furnaces, and semiconductor equipment
- Crucibles for metal evaporation
- Nozzles, thimbles, and molds for metal processing
Features and Benefits
- Excellent resistance to chemical attack from molten metals significantly extends metal processing component lifespans
- Oxidation resistance stabilizes friction levels of high-performance brakes up to 1000°C
- High hardness improves abrasion resistance
- Excellent electrical conductivity at room temperature and high temperatures to enable high temperature heaters & metallization sources
Product Grades
HBC & HBT
- High purity hot pressed boron nitride
- Diffusion bonded (no binder)
- Low dielectric constant & loss tangent
- Minimal moisture pick-up
- Chemically purified (HBC)
- Thermally purified (HBT)
HBN
- Boric oxide binder
- Highest density
- Highest strength
HBR
- Calcium borate binder
- High density
- Best moisture resistance
